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Heraeus Circuits & Components

Thick Film Pastes and Clevios™ Conductive Polymer Capacitor Materials
Following the tradition to focus on markets and to offer a comprehensive product portfolio, Heraeus combines two business units supplying component materials.
Launched in January 2014, the new Circuits & Components Business Unit emerged from the former Thick Film and Components Businesses. The core activities focus on thick film pastes together with class leading Clevios™ conductive polymer capacitor materials. Using internal synergies enables Heraeus to offer even more customized solutions.
As a market leader in the production of thick film pastes and passive components metallizations, Heraeus Circuits & Components offers a broad range of resistor, dielectric, resinate and conductor pastes, capacitor terminations and inner electrodes, as well as precious metal powders and LTCC systems. The different types of pastes – applicable to various substrate materials like alumina, aluminum and steel - are used e.g. for the manufacturing of electronic circuits, passive components, sensors, fuel senders, fuel cells and transmission controls. Furthermore thick printing copper conductor pastes serve amongst others the power electronic industry.
Clevios™ conductive polymers are essential to achieve low ESR, low leakage current, good reliability and long lifetime in electrolytic capacitors. Because of its high conductivity and outstanding temperature stability, 3,4-ethylenedioxythiophene (PEDOT), is widely used in anodes in the capacitor industry. Clevios™ materials are used to manufacture traditional polymer type tantalum and aluminum capacitors, as well as new cutting edge High Voltage devices. Clevios™ products offered are ready-to-use Clevios™ K types and, for in-situ polymerization, Clevios™ M monomer along with Clevios™ C oxidizer.
Our leading edge products and technologies will keep your business at the front.

Products & Applications

Heraeus at IMAPS 2014

Visit Heraeus at IMAPS in San Diego,
USA on October 13th to 16th 2014
Booth No. 205

Exhibition overview

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